Showing results: 106 - 120 of 130 items found.
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Model 5973 -
Pentek, Inc.
- VITA-57.1 FMC site offers access to a wide range of possible I/O- Supports Xilinx Virtex-7 VXT FPGAs- GateXpress supports dynamic FPGA reconfiguration across PCIe4 GB of DDR3 SDRAM- PCI Express (Gen. 1, 2 and 3) interface up to x8- User-configurable gigabit serial interface- LVDS connections to the Virtex-7 FPGA for custom I/O- Optional optical interface for backplane gigabit serial interboard communication- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-66.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available
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Model 5973-317 -
Pentek, Inc.
- Supports Xilinx Virtex-7 VXT FPGA- GateXpress supports dynamic FPGA reconfiguration across PCIe- Eight 250 MHz 16-bit A/Ds- Eight multiband DDCs- 4 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- PCI Express (Gen. 1, 2 and 3) interface up to x8- User-configurable gigabit serial interface- Optional optical Interface for backplane gigabit serial interboard communication- Optional LVDS connections to the Virtex-7 FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-66.4 and VITA-65 (OpenVPX™ System Specification)Ruggedized and conduction-cooled versions available
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GX7200 Series -
Marvin Test Solutions, Inc.
The GX7200 Series mainframes are 21-slot PXI chassis that can accommodate up to 20 instruments as well as a PXI Express controller (an embedded CPU or a PXI bus expander interface such as the MXI). The backplane architecture supports Gen 2 PCI Express bus signaling and the use of both x1 or x4 system controllers. By offering a combination of PXI-1, Hybrid, and Express slots, the GX7200 offers users the ultimate in flexibility for general purpose as well as high bandwidth test needs.
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81133A -
Keysight Technologies
The Keysight 81133A single-channel 3.35 GHz Pulse Pattern Generator is the latest product in the long history of Keysights high-speed Pulse Pattern Generators. When timing and performance requirements are critical, for example in high-speed serial bus applications like PCI Express or Serial ATA, its fast rise times and low intrinsic jitter allow the precise and in-depth characterization of devices, e.g. receivers or backplanes. Like its predecessor, the Keysight 8133A, the new 81133A sets the standard for high-speed applications. The Keysight 81133A lets you test your DUT instead of the pulse or data source! For applications that require multiple output channels or multi-level signaling like pre- and de-emphasis (PCI Express) or squelch (Serial ATA), please refer to the 81134A.
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Model 5983 -
Pentek, Inc.
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family BrochureVITA-57.4 HSFC FMC+ site offers access to a wide range of possible I/O- Supports Xilinx Kintex UltraScale FPGAs- 9 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- User-configurable gigabit serial interface- LVDS connections to the Kintex UltraScale FPGA for custom I/O- Optional optical interface for backplane gigabit serial interboard communication- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-66.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available
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3U PMC Carrier -
PCI EmbeddedComputer Systems
This conduction cooled 3U CompactPCI single slot PMC provides an active interface between the CompactPCI bus (backplane) and a PCI Mezzanine Card (PMC). This product addresses the needs of aerospace, military, and rugged applications. It contains a thermal heat frame made of aluminum that fits together with conduction cooled PMC modules. Conduction cooling conducts heat away from the hot spots of the board and transfers the heat to the card edges and to the system chassis. No active ventilation is necessary inside of the system, which means the boards are sealed from the environmental influences found outside of the chassis. The heat frame and integrated wedge locks for the conduction cooling stiffens carrier and PMC module enabling the board to resist high shock and vibration.
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6U PMC Carrier -
PCI EmbeddedComputer Systems
This conduction cooled 6U CompactPCI dual slot PMC provides an active interface between the CompactPCI bus (backplane) and a PCI Mezzanine Card (PMC). This product addresses the needs of aerospace, military, and rugged applications. It contains a thermal heat frame made of aluminum that fits together with conduction cooled PMC modules. Conduction cooling conducts heat away from the hot spots of the board and transfers the heat to the card edges and to the system chassis. No active ventilation is necessary inside of the system, which means the boards are sealed from the environmental influences found outside of the chassis. The heat frame and integrated wedge locks for the conduction cooling stiffens the carrier and PMC module enabling the board to resist high shock and vibration.
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CIC301 - MIL-STD-1553 -
Andor Design Corp.
The CIC301 is a full-featured, high performance, Dual Redundant MIL-STD-1553 A/B serial bus Simulator Analyzer Tester designed as a plug in card for PCI backplane. The CIC301 includes full error injection and can operate in independent or simultaneous mode as a Bus Controller, multiple simulated Remote Terminals and full/selective Monitor. Its data structure can be changed on the fly without interrupting the processor for real time operation. The active monitor stores, time tag and annotates bus traffic with the message type and any detected errors. Stored words are annotated with a break down of the word error.
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FAB100 -
Axiomtek Co., Ltd.
The FAB100 features one CPU card slot, four ISA slots, four PCI-E x1 slots, one PCI-E x16 slot, and four 32bit/33MHz PCI slots. This PICMG 1.3 backplane also supports a built-in 24-pin ATX power connector. Furthermore, the FAB100 delivers outstanding system performance through high-bandwidth interfaces such as Serial ATA and USB 2.0 high speed peripheral (optional function). It is designed for all of PICMG 1.3 single board computers, and is a perfect fit for AXIOMTEK's SHB100 & SHB110, which are built around the PICMG 1.3 form factor. We also have various 4U-high enclosures, AX6156E, AX6156LE, AX6156LLE, AX6156LLES, AX61400, AX61491 and AX6145, to house the FAB100 and any customer's industrial integrations flexibly.
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Data Patterns Pvt. Ltd.
Modules in compact PCI from Data Patterns are available for Data Acquisition and Control, Simulation, Communication Automatic test equipment, Rugged systems, Fail-safe systems, Computer controlled logic controls, Plant automation and similar requirements. Other I/O functions available from our IP and Mezzanine Module families can be directly integrated into our cPCI systems.Data Patterns has also pioneered cPCI derivatives such as 9U High Voltage systems, Multiple backplane support with Hot Standby Switchover capabilities. Continuous innovation enables MMI options such as CRT & LCD displays, Keyboards, Pointing devices, Finger print security devices and so on.
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Model 5983-317 -
Pentek, Inc.
- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- VITA-57.4 HSFC FMC+ site offers access to a wide range of possible I/O- Supports Xilinx Kintex UltraScale FPGAs- Eight 250 MHz 16-bit A/Ds- Eight multiband DDCs- 4 GB and 5 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- PCI Express (Gen. 1, 2 and 3) interface up to x8- User-configurable gigabit serial interface- Optional optical interface for backplane gigabit serial interboard communication- LVDS connections to the Kintex UltraScale FPGA for custom I/O and synchronization- Compatible with several VITA standards including: VITA-46, VITA-48 AND VITA-66.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Please refer to the product datasheet for Installed FPGA IP Module details
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Marvin Test Solutions, Inc.
The GX7100e Series are 14-slot combination PXIe chassis that accommodate a 3U PXIe embedded controller or a MXI express controller as well as 3U & 6U PXI / PXIe insruments in 4U of rack space. The GX7100e’s unique format includes seven 6U slots and seven 3U slots arranged horizontally to reduce the overall size of the chassis, providing the versatility and high-density necessary to address many PXI / PXIe applications and requirements. The backplane architecture supports Gen 2, 4x4 PCI Express bus signaling and the use of both x1 or x4 system controllers. By offering a combination of PXI-1, Hybrid, and Express slots, the GX7100e offers users the ultimate in flexibility for general purpose as well as high bandwidth test needs.
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GX7100e Series -
Marvin Test Solutions, Inc.
The GX7100e Series are 14-slot combination PXIe chassis that accommodate a 3U PXIe embedded controller or a MXI express controller as well as 3U & 6U PXI / PXIe insruments in 4U of rack space. The GX7100e’s unique format includes seven 6U slots and seven 3U slots arranged horizontally to reduce the overall size of the chassis, providing the versatility and high-density necessary to address many PXI / PXIe applications and requirements. The backplane architecture supports Gen 2, 4x4 PCI Express bus signaling and the use of both x1 or x4 system controllers. By offering a combination of PXI-1, Hybrid, and Express slots, the GX7100e offers users the ultimate in flexibility for general purpose as well as high bandwidth test needs.
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VP32001 -
LinkedHope Intelligent Technologies Co.,Ltd.
The VP32001 is a PC-compatible high performance 3U VPX processor board supporting the 2nd generation Intel® Core™ processor and the Intel® Series 6 mobile class chipset with up to 8 Gbytes of DDR3-1333 ECC SDRAM. The VP32001 features an XMC site and a range of I/O interfaces including two SATA600 channels, dual 1000Base-BX, RS232/422/485 and USB interfaces. The board provides a flexible PCI Express® (PCIe) backplane fabric interface that can be configured in several ways from eight x1 PCIe ports to a single x8 PCIe port making it suitable for use in both distributed systems and centralized switching systems as defined in OpenVPX (VITA 65). For rugged applications two VPX-REDI conduction-cooled versions are available, the VP32001-RCS is a VPX-REDI Type 1 Two-Level Maintenance conduction-cooled board and the VP32001-RCT is VPX-REDI Type 2. The board is suitable for a range of applications within industrial control, transport, aerospace, security and defense applications. To simplify integration many standard operating systems are supported.
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MIC-6330 -
Advantech Co. Ltd.
Based on the Intel® Xeon® E3 Lv5 and Lv6 embedded platform, the MIC-6330 builds on the success of Advantech’s 6U VPX boards, and is the first 3U VPX product launched by Advantech. Together with the Intel® processor, the MIC-6330 offers intense computational ability in a very compact form factor. The MIC-6330 provides configurable connectivity (up to four ports) of PCI Express via the backplane to the highest performance mainstream peripherals and I/O cards, and vast I/O functions for extended interconnectivity and controllability. The MIC-6330 meets various computing needs, including vPro™ and workstation capabilities, by using the Intel® CM236/CM238 PCH. The MIC-6330 offers high storage capacity at up to SATA 6Gbps transfer speed. Four USB2.0 ports and one USB 3.0 port to the backplane fulfill requirements for extra I/O ports or storage, up to 5Gbps data rate. Four GbE ports (two ports configurable as SERDES) support system level IP connectivity, and the UART interfaces (RS-232/422/485 selectable) can be leveraged as an interface to legacy devices and consoles. Like Advantech’s 6U VPX products, the MIC-6330 supports multiple displays, and the maximum resolution of the MIC-6330 is 4K, empowered by the Intel® integrated graphics engine. The MIC-6330 also offers a High Definition Audio to the backplane interface for media demands. With the standard ruggedized convection cooled heatsink or the optional air-cooled heatsink, the MIC-6330 is tailored for harsh environmental applications and adaptable to various chassis designs. The industrial NAND Flash, and the soldered onboard DDR4 ECC memory chips are appropriate for a variety of vehicle applications for the maximum reliability. The MIC-6330 is sophisticated and suitable for various purposes. An onboard X8D XMC site with PCIE x8 gen.3 connectivity can host high speed offload or I/O mezzanines for project-specific applications. For applications that need the maximum expandability, the XMC interface can be modified to add another DisplayPort and the 2 more UART. The optional front I/O module facilitates the development and qualification process, and also enables the possibility of the front panel access.
